Highly Chemical Reactive Ion Etching of Gallium Nitride

Highly Chemical Reactive Ion Etching of Gallium Nitride

A highly chemical reactive ion etching process has been developed for MOVPE-grown GaN on sapphire. The key element for the enhancement of the chemical property during etching is the use of a fluorine containing gas in a chlorine based chemistry. In the perspective of using GaN substrates for homo-epitaxy of high quality GaN/AlGaN structures we have used the above described RIE process to smooth...

Gallium Nitride-Based Chemical Sensors

The rapid progress in semiconductor materials and devices has promoted the development of the sensors industry. Large band gap semiconductors are ideal candidates for a variety of sensor applications. In particular, gallium nitride (GaN) is used as the sensing element for the development of chemical sensors. The recognition mechanism is based on the selective interaction of anions in solution w...

Reactive ion etching

The reactive ion etching ofInP, InGaAs, and InAIAs in CClzF2/02 or C2R(/H2 discharges was investigated as a function of the plasma parameters pressure, power density, flow rate, and relative composition. The etch rates of these materials are a factor of 3-5 X faster in CC12F 2/0 2 (-600--1000 AminJ ) compared to CzHJH2 (160-320 AminI ). Significantly smoother morphologies are obtained with C2H6...

Deep Reactive Ion Etching (DRIE)

The fabrication of silicon nanostructures by local gallium implantation and cryogenic deep reactive ion etching.

We show that gallium-ion-implanted silicon serves as an etch mask for fabrication of high aspect ratio nanostructures by cryogenic plasma etching (deep reactive ion etching). The speed of focused ion beam (FIB) patterning is greatly enhanced by the fact that only a thin approx. 30 nm surface layer needs to be modified to create a mask for the etching step. Etch selectivity between gallium-doped...